Job Details:

Job Description: 

As a Module Development Engineer, you will be integral to advancing Intel's manufacturing processes and semiconductor technology. You will lead efforts in the development and optimization of cutting-edge defect inspection tools and advanced manufacturing solutions. This role empowers you to influence high-volume manufacturing, drive technology pathfinding initiatives, and shape the future of Intel's industry-leading innovations. Collaborating with key equipment and material suppliers, you will help develop solutions that align with Intel's future roadmap, ensuring cost efficiency, scalability, and industry leadership.

Key Responsibilities

• Design, develop, and optimize advanced manufacturing processes, including material selection, parameter optimization, equipment metrology, and system design.
• Lead feasibility studies and pathfinding activities to innovate device architectures and align with next-generation roadmaps.
• Develop and implement defect inspection technologies for high-volume manufacturing and future technology processes.
• Partner with equipment and material suppliers to implement enabling technologies that support Intel's strategic goals.
• Recommend and execute modifications to improve equipment performance, optimize production efficiency, and enhance manufacturing techniques.
• Conduct process technology feasibility studies using theoretical simulations and practical engineering methods.
• Stay informed on industry trends and advancements to shape Intel's semiconductor technology needs.
• Develop cost-sensitive technology roadmaps by collaborating with vendors to push industry boundaries.

Qualifications:

You must possess the below minimum qualifications to be initially considered for this position. Preferred qualifications are in addition to the minimum requirements and are considered a plus factor in identifying top candidates. This position is not eligible for Intel immigration sponsorship.

Minimum Qualifications

• Bachelor's degree in Mechanical Engineering, Electrical Engineering or STEM related field with 1+ years of relevant experience in:

• Technical expertise in semiconductor processing, system controls, opto-mechanics, or mechanical systems.
• Proficiency in Statistical Process Control (SPC) and Design of Experiments (DOE) principles.
• Programming experience in Python or MATLAB.
• Hands-on experience with robotics, automation systems, vision systems, or image processing.

Preferred Qualifications

• Master's degree or PhD in Mechanical Engineering, Electrical Engineering or STEM related field.

• Experience in Advanced Packaging

• Demonstrated ability to troubleshoot manufacturing processes and equipment.

• Experience with packaging processes, equipment automation development, or project management.

• Strong problem-solving skills, adaptability, and ability to manage multiple tasks effectively.

• Passionate about contributing to Intel's strategic advancements and driving meaningful industry innovation.

We invite you to bring your expertise and creativity to Intel, where you will have the opportunity to innovate, collaborate, and shape the future of semiconductor technology. Apply now and join our dynamic team.

          

Job Type:

College Grad

Shift:

Shift 1 (United States of America)

Primary Location: 

US, Oregon, Hillsboro

Additional Locations:

Business group:

Intel Foundry strives to make every facet of semiconductor manufacturing state-of-the-art while delighting our customers -- from delivering cutting-edge silicon process and packaging technology leadership for the AI era, enabling our customers to design leadership products, global manufacturing scale and supply chain, through the continuous yield improvements to advanced packaging all the way to final test and assembly. We ensure our foundry customers' products receive our utmost focus in terms of service, technology enablement and capacity commitments. Employees in the Foundry Technology Manufacturing are part of a worldwide factory network that designs, develops, manufactures, and assembly/test packages the compute devices to improve the lives of every person on Earth.

Posting Statement:

All qualified applicants will receive consideration for employment without regard to race, color, religion, religious creed, sex, national origin, ancestry, age, physical or mental disability, medical condition, genetic information, military and veteran status, marital status, pregnancy, gender, gender expression, gender identity, sexual orientation, or any other characteristic protected by local law, regulation, or ordinance.

Position of Trust

N/A

Benefits

We offer a total compensation package that ranks among the best in the industry. It consists of competitive pay, stock bonuses, and benefit programs which include health, retirement, and vacation. Find out more about the benefits of working at Intel.

 

 

Annual Salary Range for jobs which could be performed in the US: $99,030.00-188,890.00 USD

 

 

The range displayed on this job posting reflects the minimum and maximum target compensation for the position across all US locations. Within the range, individual pay is determined by work location and additional factors, including job-related skills, experience, and relevant education or training. Your recruiter can share more about the specific compensation range for your preferred location during the hiring process.

 

 

Work Model for this Role

This role will require an on-site presence. * Job posting details (such as work model, location or time type) are subject to change.

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ADDITIONAL INFORMATION: Intel is committed to Responsible Business Alliance (RBA) compliance and ethical hiring practices. We do not charge any fees during our hiring process. Candidates should never be required to pay recruitment fees, medical examination fees, or any other charges as a condition of employment. If you are asked to pay any fees during our hiring process, please report this immediately to your recruiter.