The Advanced Packaging Substrate Integration Team is seeking qualified candidates to deliver the on-time supplier capacity expansion needed to meet foundry customer demand for the latest advanced heterogeneous packaging technology, EMIB-T. New process tools, new supplier processing lines, and, in some cases, new factories need to be qualified to meet customer requirements. A combination of detail-oriented project management, strong technical risk assessment / problem solving skills, and effective supplier / stakeholder management will be needed to be successful.

Responsibilities will include at least the following:

• Scoping / Planning - HVM process flow finalization and process tool requirements definition with the TD team and the supplier. Tool selection and production line qualification planning so as to minimize ramp risk and meet certification requirements. Existing and, as necessary, new factory planning / layout to maximize yield and new capacity in the minimum time within budget. Update plans as necessary or as contingencies for customer / technical / volume requirements changes.

• CapEx Project Execution through Production Ramp - on-time execution of management-aligned capacity expansion plans through systematic processes. Create and drive yield-enabling/yield-improvement plans. Drive qualification activities and closely monitor ramp indicators to insure incident-free production ramp of new capacity. Anticipate and quickly resolve technical and logistical problems that would risk quality or on-time delivery of committed capacity. Development and maintenance of supplier milestone progress dashboards to focus resources and keep projects on-track.

• Capability Transfer - Where necessary, facilitate technical capability transfer from internal pilot manufacturing line to supplier capacity expansion line. Assess supplier knowledge gaps relative to technical and schedule requirements to create and drive gap closure / risk mitigation plans.

• Regular updates to management / stakeholders on progress and risk mitigation activities.

The successful candidate must demonstrate the following:

• Strong written and verbal communication and stakeholder management skills.

• Bias for action.

• Strategic leadership capabilities with capacity to influence with data in highly matrixed organizations.

• Given the level of maturity of the technologies involved and the dynamic nature of the customer requirements, a high tolerance for ambiguity is essential.

• Demonstrated skills to work well with teams of technical/commercial stakeholders across organizations to accomplish objectives on-time through work groups and, as necessary, task forces.

This is a hands-on position that requires extensive work with supplier teams (through F2F meetings with local reps, phone/Teams meetings, and international travel to supplier factories), internal integration teams, and process module engineering teams to achieve new capacity qualification and ramp production on-time.

Additional information:
International travel will be expected / required several times per year to drive milestone execution and validate regular supplier progress.

Minimum qualifications are required to be initially considered for this position. Preferred qualifications are in addition to the minimum requirements and are considered a plus factor in identifying top candidates.

Minimum Qualifications:

• PhD in Materials Science, Mechanical Engineering, Electrical Engineering, Chemical Engineering, Organic Chemistry, Polymer Engineering or relevant field and 3+ years of relevant experience

• -OR- Masters Degree in Materials Science, Mechanical Engineering, Electrical Engineering, Chemical Engineering, Organic Chemistry, Polymer Engineering, or relevant field and 5+ years of relevant experience

Relevant experience must include the following:

• Demonstrated experience achieving integrated process, materials, chemistry, and/or tool hardware development and customer qualification milestones on-time.

• 2+ years’ experience with advanced semiconductor packaging / substrates.

• Experience managing cross-functional teams across multiple time zones and cultural contexts.

• Strong understanding of process building blocks (including component embedding, laser drilling, dielectric lamination, lithography, multi-metal electrolytic plating, defect inspection/metro, electrical test, etc.) and critical process interactions.

• Strong knowledge of DOE, PCS, and SPC.

Preferred qualifications:

• Experience qualifying / owning process tools in a TD and/or HVM context is highly desired.

• Supplier-/geography-relevant language skills a plus.

• Direct prior process qualification experience with semiconductor packaging suppliers is a plus.

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