at Apple
Location
San Francisco Bay Area, United States of America
Compensation
$203k–$306k USD
Type
full time
Posted
4 months ago
Market range · company + function + seniority
p25 · target · p75 · n=800
Posted $306k · in the market band
Posting health
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This position blends finite element simulation with hands-on materials characterization. You will work on semiconductor packages, PCB systems, and SMT assemblies — developing predictive models that inform design direction, reliability strategy, and manufacturing readiness.
You’ll partner closely with design, reliability, and manufacturing teams to define key load cases, build and validate material models, and reduce risk early in development. Your work will help close the gap between simulation and hardware through disciplined experimentation and correlation.
Develop and execute finite element models (implicit and explicit) for semiconductor packaging, PCB structures, and SMT assemblies
Analyze thermo-mechanical behavior including warpage, stress evolution, drop/shock, fatigue, and fracture
Lead or support material characterization efforts (mechanical, physical, chemical) for microelectronics materials
Build, calibrate, and validate material models using experimental data
Design and execute DOEs to correlate simulation with test results and support reliability projections
Drive early design optimization and support root cause investigations of mechanical failures
Integrate module-level simulations into larger product assembly models
Communicate analysis results clearly to cross-functional stakeholders
3+ years of experience in finite element modeling
Strong foundation in solid mechanics and thermomechanics
Experience with CAE tools such as Ansys, Abaqus, or equivalent
Experience working with materials used in microelectronics applications
MS or PhD in Mechanical Engineering, Materials Science, Applied Mechanics, Chemical Engineering, or related field
Experience in warpage, fracture mechanics, fatigue, or drop/impact modeling
Familiarity with semiconductor packaging and SMT processes
Experience correlating simulation models with physical testing
Understanding of DOE methodology and reliability physics
Strong written and verbal communication skills
Comfortable working in a fast-paced, cross-functional environment
At Apple, innovative ideas become extraordinary products through deep engineering rigor and strong cross-functional collaboration. The DFM R&D Lab plays a critical role in developing the materials, processes, and predictive modeling frameworks that enable advanced semiconductor packaging and microelectronics technologies to scale reliably to high-volume manufacturing.
We are seeking an R&D Engineer who is excited to solve complex mechanical challenges, connect simulation with real-world data, and influence product decisions through thoughtful, physics-based analysis.
Apple is an equal opportunity employer that is committed to inclusion and diversity. We seek to promote equal opportunity for all applicants without regard to race, color, religion, sex, sexual orientation, gender identity, national origin, disability, Veteran status, or other legally protected characteristics. Learn more about your EEO rights as an applicant
At Apple, we believe accessibility is a fundamental human right. You’ll find that idea reflected in everything here — in our culture, our benefits and our digital tools. By welcoming as many perspectives as possible, we help you build a career where you feel like you belong.
Learn about accessibility in Apple’s workplace
Learn about reasonable accommodations for job applicants
Apple accepts applications to this posting on an ongoing basis.
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