at Apple
Location
Santa Clara, United States of America
Compensation
$127k–$221k USD
Type
full time
Posted
Yesterday
Market range · company + function + seniority
p25 · target · p75 · n=800
Posted $221k · below the band
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In this role, you will drive the definition, development, and qualification of next-generation memory packages critical to Apple’s future products.
You will guide the package roadmaps of our memory partners and collaborate with internal engineering teams to enable bandwidth and density scaling.
Your ownership will span the entire product lifecycle, from initial concept through qualification.
Determine the direction of next-generation package architecture by evaluating available and emerging packaging technologies.
Collaborate with cross-functional teams to solve integration challenges, including electrical, mechanical, and thermal.
Drive vendor DOEs and failure analysis to improve downstream yield and maintain world-class quality and reliability.
Define the memory package POR (plan of record): Package form factor, process, layout, stackup, and bill of materials (BOM).
Drive memory vendors to develop package materials and technology for leading-edge package design rules.
Minimum requirement of a bachelor's degree in a relevant field
MS or PhD preferred, with 3+ years of industry experience in package design and assembly process development of high-bandwidth and high-density memory packages.
Strong knowledge of thin-die stacking technologies including wirebond, flip-chip, and wafer/die bonding.
Strong knowledge of packaging materials and design to engineer warpage and CTE properties and mitigate thermal challenges.
Solid working experience in package test and reliability, system-level downstream process interaction, and packaging inspection metrology.
Deep understanding of SI/PI co-design with memory die and high-speed DDR or differential signaling.
Understanding of how memory die floorplan and architecture influence package structure and routing, with experience collaborating with memory die design teams.
Excellent communication skills for collaborating with internal teams and managing external vendors.
Join the team at the heart of memory innovation for every Apple product. As a Memory Packaging Engineer, you will architect the memory solutions that power the industry-leading performance of Apple's hardware. We push the boundaries of bandwidth density, power efficiency, and system integration through meticulous co-design between memory technology and our world-class systems. If you are driven to solve the industry's toughest packaging challenges, your work will have a profound and lasting impact on the products used by millions.
At Apple, base pay is one part of our total compensation package and is determined within a range. This provides the opportunity to progress as you grow and develop within a role. The base pay range for this role is between $126,800 and $220,900, and your base pay will depend on your skills, qualifications, experience, and location.Apple is an equal opportunity employer that is committed to inclusion and diversity. We seek to promote equal opportunity for all applicants without regard to race, color, religion, sex, sexual orientation, gender identity, national origin, disability, Veteran status, or other legally protected characteristics. Learn more about your EEO rights as an applicant
At Apple, we believe accessibility is a fundamental human right. You’ll find that idea reflected in everything here — in our culture, our benefits and our digital tools. By welcoming as many perspectives as possible, we help you build a career where you feel like you belong.
Learn about accessibility in Apple’s workplace
Learn about reasonable accommodations for job applicants
Apple accepts applications to this posting on an ongoing basis.
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