Advanced Packaging Engineer - SI/PI

About Marvell

Marvell’s semiconductor solutions are the essential building blocks of the data infrastructure that connects our world. Across enterprise, cloud and AI, and carrier architectures, our innovative technology is enabling new possibilities. 

At Marvell, you can affect the arc of individual lives, lift the trajectory of entire industries, and fuel the transformative potential of tomorrow. For those looking to make their mark on purposeful and enduring innovation, above and beyond fleeting trends, Marvell is a place to thrive, learn, and lead. 

Your Team, Your Impact

Join Marvell’s central packaging organization responsible for enabling next‑generation connectivity and compute products. You’ll contribute to the design, modeling, and validation of advanced IC packages supporting high‑speed interfaces. Your work in SI/PI will directly influence product performance, reliability, and time‑to‑market.

What You Can Expect

• Collaborate with IC design, physical layout, assembly engineering, and marketing to support package planning and substrate design.
• Build and correlate SI/PI models for advanced interconnects; perform 2D/3D EM simulations and generate routing, stack‑up, and decoupling guidelines.
• Analyze power‑distribution networks and high‑speed signal paths from pre‑layout through post‑layout.
• Perform VNA and TDR characterization of package/PCB structures and compare bench data with simulations.
• Automate analysis workflows using Python (e.g., simulation sweeps, reporting, rule checks).
• Document technical results and present recommendations to cross‑functional teams.
• Contribute to design reviews and support the release of package designs to manufacturing.
• Use tools such as HFSS, SI‑Wave/Clarity, PowerSI, Spectre/ADS/HSpice, and APD or PADS.

What We're Looking For

• MS or PhD in Electrical/Electronics Engineering, Materials Science, or related fields.
• Strong fundamentals in electromagnetics, transmission lines, and microwave theory.
• Experience with 2D/3D EM simulation tools (HFSS, SI‑Wave, Clarity).
• Familiarity with IC package layout tools such as APD or PADS.
• Understanding of high‑speed signaling in both frequency and time domain.
• Exposure to VNA/TDR characterization methods.
• Working knowledge of circuit‑simulation tools (Spectre, ADS, HSpice).
• Python scripting experience for SI/PI or packaging automation.
• Familiarity with packaging technologies, materials, substrate design rules, and assembly processes.
• Awareness of EMI/EMC debugging and simulation practices.
• Bonus: Experience with 2.5D/3D package development, MATLAB‑based channel simulations, or basic thermal/mechanical analysis.
• Strong communication, presentation, and documentation skills.
• A collaborative team player eager to learn and grow.

Expected Base Pay Range (USD)

97,630 - 146,300, $ per annum

The successful candidate’s starting base pay will be determined based on job-related skills, experience, qualifications, work location and market conditions. The expected base pay range for this role may be modified based on market conditions.

Additional Compensation and Benefit Elements 

Marvell is committed to providing exceptional, comprehensive benefits that support our employees at every stage - from internship to retirement and through life’s most important moments. Our offerings are built around four key pillars: financial well-being, family support, mental and physical health, and recognition. Highlights include an employee stock purchase plan with a 2-year look back, family support programs to help balance work and home life, robust mental health resources to prioritize emotional well-being, and a recognition and service awards to celebrate contributions and milestones. We look forward to sharing more with you during the interview process.

All qualified applicants will receive consideration for employment without regard to race, color, religion, sex, national origin, sexual orientation, gender identity, disability or protected veteran status.

Any applicant who requires a reasonable accommodation during the selection process should contact Marvell HR Helpdesk at TAOps@marvell.com.

Interview Integrity 

To support fair and authentic hiring practices, candidates are not permitted to use AI tools (such as transcription apps, real-time answer generators like ChatGPT or Copilot, or automated note-taking bots) during interviews.

These tools must not be used to record, assist with, or enhance responses in any way. Our interviews are designed to evaluate your individual experience, thought process, and communication skills in real time. Use of AI tools without prior instruction from the interviewer will result in disqualification from the hiring process.

This position may require access to technology and/or software subject to U.S. export control laws and regulations, including the Export Administration Regulations (EAR). As such, applicants must be eligible to access export-controlled information as defined under applicable law. Marvell may be required to obtain export licensing approval from the U.S. Department of Commerce and/or the U.S. Department of State. Except for U.S. citizens, lawful permanent residents, or protected individuals as defined by 8 U.S.C. 1324b(a)(3), all applicants may be subject to an export license review process prior to employment.

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