Module Process Engineer IV - (E4) – Plasma Etch

Who We Are

Applied Materials is a global leader in materials engineering solutions used to produce virtually every new chip and advanced display in the world. We design, build and service cutting-edge equipment that helps our customers manufacture display and semiconductor chips – the brains of devices we use every day. As the foundation of the global electronics industry, Applied enables the exciting technologies that literally connect our world – like AI and IoT. If you want to push the boundaries of materials science and engineering to create next generation technology, join us to deliver material innovation that changes the world. 

What We Offer

Salary:

$116,000.00 - $159,500.00

Location:

Boise,ID

You’ll benefit from a supportive work culture that encourages you to learn, develop, and grow your career as you take on challenges and drive innovative solutions for our customers. We empower our team to push the boundaries of what is possible—while learning every day in a supportive leading global company. Visit our Careers website to learn more. 

At Applied Materials, we care about the health and wellbeing of our employees. We’re committed to providing programs and support that encourage personal and professional growth and care for you at work, at home, or wherever you may go. Learn more about our benefits. 

Key Responsibilities

• Lead technical discussions with customers to understand High Value Problems (HVPs) and define, propose, and implement Continuous Improvement Projects (CIPs).

• Capture and institutionalize learnings to maximize service opportunities and deliver measurable improvements to customer KPIs.

• Increase Customer Service Agreement (CSA) value through defect reduction, variability reduction, cost‑of‑ownership (COO) improvement, preventive maintenance optimization, process Cpk improvement, tool matching, and output optimization.

• Identify and drive opportunities for CSA renewal, upsell, and penetration.

• Demonstrate and lead adoption of new service technologies, including FabVantage offerings, through customer demos, on‑site evaluations, and Joint Development Programs (JDPs).

• Resolve complex equipment and process issues using advanced analytics, equipment and process expertise, and systematic troubleshooting methodologies to perform effective root cause diagnosis.

• Generate comprehensive technical reports and present findings to customers, including prioritization and recommendations based on analysis of Bill of Materials (BOM), Equipment Constants (EC), tool sensor data, on‑wafer results, and benchmarking across products.

• Serve as a technical authority in plasma etch, providing guidance on integration, yield, and manufacturability challenges.

• Mentor and lead junior‑level MPEs, providing technical direction, coaching, and knowledge transfer.

Functional & Technical Knowledge

• Recognized technical expert with deep process engineering experience in plasma etch technologies and strong Wafer Fab background.

• In‑depth knowledge of hardware and processes across one or more plasma etch areas; experience with two or more technologies strongly preferred.

• Domain knowledge of four or more processes spanning two or more technologies.

• Must have strong data analytics capability to analyze complex process, yield, and equipment issues.

• Broad understanding of adjacent disciplines with advanced integration knowledge considered a strong plus.

Business & Leadership Competencies

• Interprets internal and external business challenges and recommends best practices to improve products, processes, and services.

• Leads functional teams or projects with moderate complexity, risk, and resource requirements.

• Drives complex problem solving using advanced analytical judgment and innovative solution development.

• Impacts customer, operational, project, and service objectives while operating within established functional policies.

• Communicates complex technical concepts clearly and effectively; negotiates and influences stakeholders, often at senior levels, to adopt new approaches or solutions.

Qualifications

• BS in Engineering, Physics, or Chemistry (or equivalent).

• 7+ years of experience in plasma etch process engineering.

• Strong Wafer Fab and semiconductor equipment experience.

• Proven technical expertise in plasma etch unit processes and Wafer Fab operations.

• Demonstrated ability to communicate complex ideas, anticipate objections, and persuade senior stakeholders.

• Ability to travel domestically as assigned <50% per month depending on customer project support.

Additional Information

Time Type:

Full time

Employee Type:

Assignee / Regular

Travel:

Yes, 25% of the Time

Relocation Eligible:

Yes

The salary offered to a selected candidate will be based on multiple factors including location, hire grade, job-related knowledge, skills, experience, and with consideration of internal equity of our current team members. In addition to a comprehensive benefits package, candidates may be eligible for other forms of compensation such as participation in a bonus and a stock award program, as applicable.

For all sales roles, the posted salary range is the Target Total Cash (TTC) range for the role, which is the sum of base salary and target bonus amount at 100% goal achievement.

Applied Materials is an Equal Opportunity Employer. Qualified applicants will receive consideration for employment without regard to race, color, national origin, citizenship, ancestry, religion, creed, sex, sexual orientation, gender identity, age, disability, veteran or military status, or any other basis prohibited by law.

In addition, Applied endeavors to make our careers site accessible to all users. If you would like to contact us regarding accessibility of our website or need assistance completing the application process, please contact us via e-mail at Accommodations_Program@amat.com, or by calling our HR Direct Help Line at 877-612-7547, option 1, and following the prompts to speak to an HR Advisor. This contact is for accommodation requests only and cannot be used to inquire about the status of applications.