at Apple
Location
San Francisco Bay Area, United States of America
Compensation
$129k–$225k USD
Type
full time
Posted
1 months ago
Market range · company + function + seniority
p25 · target · p75 · n=800
Posted $225k · in the market band
Posting health
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Join our WLP team and help develop next-generation Wafer Level Packaging and 2.5D / 3D solutions. You'll start by supporting package concept exploration, selection and configuration studies, and prototype evaluations, while contributing to process development efforts that mature packaging solutions toward mass-production (MP) readiness on product. You'll partner with design, test, reliability, and product teams as well as foundry and OSAT partners, and grow over time into end-to-end ownership of well-scoped deliverables across characterization, modeling, and failure analysis. We're looking for a curious, detail-oriented engineer with strong fundamentals, a passion for precision, and the drive to learn quickly and solve hard problems.
Support packaging technology development, including advanced 2.5D / 3D packaging
Contribute to multi-functional SoC package integration efforts — design, test, characterization, reliability, and product teams.
Participate in package architecture trade-off studies and prototype evaluations.
Collaborate with foundry and OSAT partners on build execution, DOEs, and data analysis.
Own well-scoped technical deliverables (characterization, modeling, failure analysis, product development) end-to-end
5% International travel
Minimum requirement of a bachelors degree
MS or PhD in a relevant discipline, with a thesis or coursework in semiconductor packaging, materials, thermal, mechanical, or electrical modeling
Internship or research experience with a semiconductor company, OSAT, foundry, or academic packaging/materials lab.
Familiarity with one or more of: Wafer Level Packaging, 2.5D / 3D packaging, memory packaging, assembly processes, IC packaging materials, or reliability standards.
Exposure to materials characterization tools (SEM, EDX, CSAM, FTIR, DMA, TMA, etc.) or FA techniques, ideally on wafer level
General understanding of wafer level packaging technologies, assembly processes, IC packaging materials, reliability standards, FA techniques, etc.
Excellent interpersonal skills and has strong business partnership building and collaboration with multi-functional teams and overseas suppliers
Ability to work independently and orchestrate projects with cross functional teams
Solution-oriented mindset with strong fundamentals in engineering physics
Good program management skills.
Do you like to work on groundbreaking technology? Have a passion for creating amazing products? Our team is looking for a curious, detail-oriented IC Packaging Engineer, with a strong technical foundation and a love for excellence and precision, to help deliver extraordinary results. In this role, you will contribute to package concept exploration, support package selection and configuration studies, and grow into ownership of package integration across SoC and advanced packaging projects.
At Apple, base pay is one part of our total compensation package and is determined within a range. This provides the opportunity to progress as you grow and develop within a role. The base pay range for this role is between $129,300 and $225,300, and your base pay will depend on your skills, qualifications, experience, and location.Apple is an equal opportunity employer that is committed to inclusion and diversity. We seek to promote equal opportunity for all applicants without regard to race, color, religion, sex, sexual orientation, gender identity, national origin, disability, Veteran status, or other legally protected characteristics. Learn more about your EEO rights as an applicant
At Apple, we believe accessibility is a fundamental human right. You’ll find that idea reflected in everything here — in our culture, our benefits and our digital tools. By welcoming as many perspectives as possible, we help you build a career where you feel like you belong.
Learn about accessibility in Apple’s workplace
Learn about reasonable accommodations for job applicants
Apple accepts applications to this posting on an ongoing basis.
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