Silicon Packaging Technology Engineer

Reality Labs is delivering Meta's vision through AI-powered wearable products. The compute performance, power efficiency, and form factor requirements demand custom silicon with cutting-edge packaging solutions. We are seeking a Silicon Packaging Technology Engineer to join our team and drive advanced packaging technology from concept through productization for next-generation consumer hardware.

Responsibilities

• Lead development and roadmap creation for advanced and disruptive packaging technologies (hybrid bonding, TSV, fan-out, SiP, flip chip, SMT, solder ball attach, and assembly processes)
• Establish and manage relationships with foundries, OSATs, substrate suppliers, and material suppliers to support package development activities
• Influence and align OSAT and foundry partners' roadmaps with Meta's custom silicon packaging roadmap
• Collaborate cross-functionally with internal teams (silicon design, architecture, system, thermal, mechanical) and external partners (design houses, OSATs, substrate vendors) to ensure manufacturability, integration, and reliability
• Support test vehicle (TV) design, process feasibility, simulation, and design rule/DFM checks with emphasis on thermo-mechanical reliability
• Drive Design of Experiments (DOEs) for initial builds, product qualification, and sustaining activities
• Lead triage efforts for unexpected inline process, equipment, and quality issues; drive root cause failure analysis (FA) and corrective actions with partners
• Evaluate and address chip-package interaction (CPI) effects, board-level reliability (BLR), and component-level reliability (CLR) through simulation, testing, and data analysis
• Track technology gaps, reliability risks, and yield issues; compile and maintain POR, TOR, FMEA, and related KPIs
• Stay updated on advanced packaging technologies and market trends and identify emerging technologies
• Travel both domestically and internationally up to 10% of the time

Minimum Qualifications

• Bachelor's degree in Computer Science, Computer Engineering, relevant technical field, or equivalent practical experience
• 12+ years of experience in advanced silicon packaging development, process integration, and manufacturing
• Ability to work with mechanical and thermal constraints to co-optimize package architecture for demanding form factors
• Demonstrated cross-functional collaboration with internal teams and external partners (foundry, OSAT, substrate vendors, ODMs)
• Experience taking products from concept to prototyping and production, including manufacturing specifications, vendor qualifications, and yield/cost optimization
• Bachelor's degree in Materials Science, Electrical Engineering, Mechanical Engineering, Chemical Engineering, or a relevant technical field Master's or PhD degree in a relevant engineering discipline
• Experience with board-level and component-level reliability testing and qualification (JEDEC standards)
• Strong DOE methodology, statistical data analysis, and process characterization skills
• Experience driving failure analysis (FA) — including physical FA techniques, fault isolation, and root cause determination
• Excellent problem-solving and communication skills; the ability to influence cross-functional stakeholders
• Track record of successful complex package product qualification with OSATs
• Experience with a broad range of packaging technologies: WLCSP, fan-out RDL, WoW, CoW, PoP, SiP, flip chip, and 3D stacking
• Strong understanding of chip-package interaction (CPI), thermo-mechanical stress, and warpage management
• Ability to work independently, manage multiple programs, and travel internationally (typically once per quarter)