applinity

Packaging Design Engineer, Platforms Infrastructure Engineering

at Google

Location

Sunnyvale, CA, USA

Compensation

$159k–$230k USD

Type

full time

Posted

1 weeks ago

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Market range · company + function + seniority

$211k—$252k—$300k

p25 · target · p75 · n=800

Posted $230k · in the market band

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Job description

As a Product Design Engineer, you will design and evaluate our data center systems, identifying product requirements and contributing to research and project planning. From the chip to chiller, you are responsible for designing and optimizing an architecture that will scale with Google's continued growth. As a key member of the team, you design and evaluate systems, identify product requirements, prepare system-related documentation and contribute to research and project planning.

Our Platforms Infrastructure Engineering team designs and builds the hardware and software technologies that power all of Google's services. Our computational challenges are complex and unique, enabled by cutting-edge custom hardware designed and made in-house. Our Mechanical Product Design Engineering Team members work cross-functionally to design, build, and deploy the latest technology to support the needs of compute, storage, networking, and machine learning hardware.

Individual pay is determined by factors including job-related skills, experience, and relevant education or training.

US: $159000 - $230000 (USD) + 15% bonus target + equity + benefits

Learn more about benefits at Google.

Responsibilities

  • Develop specifications, 3D CAD models, and 2D technical drawings for packaging systems and components.
  • Identify and qualify sustainable, protective materials, and isolation components.
  • Plan and execute transit/reliability testing (shock, vibration, drop, environmental) in compliance with ISTA/ASTM standards.
  • Collaborate with suppliers to optimize tooling, tolerances, and assembly throughput.
  • Coordinate packaging design with Product, Manufacturing, Quality, and Logistics teams.

Minimum qualifications:

  • Bachelor's degree in Mechanical Engineering, Product Design, a related field, or equivalent practical experience.
  • 5 years of experience in packaging design for hardware or consumer goods.
  • Experience with ISTA (e.g., 2A, 3A) and ASTM D4169 protocols.
  • Experience using computer-aided design (CAD) tools (e.g., Creo, NX or Solidworks).

Preferred qualifications:

  • Master's degree in Packaging Engineering or Mechanical Engineering.
  • Certified Packaging Professional (CPP) credential.
  • 8 years of experience leading NPI packaging programs with global packaging and logistics services providers.
  • Experience with TOPS, CAPE, and FEA simulation tools.

In most instances, this position requires in-person interviews as part of the hiring process.

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